On September 01, 2023, the South Korean tech giant officially announced the it has developed the industry’s first and highest-capacity 32-gigabit (Gb) DDR5 DRAM using 12 nanometer (nm)-class process technology. The company mentioned that this achievement comes after Samsung began mass production of its 12nm-class 16Gb DDR5 DRAM in May 2023.
“With our 12nm-class 32Gb DRAM, we have secured a solution that will enable DRAM modules of up to 1-terabyte (TB), allowing us to be ideally positioned to serve the growing need for high-capacity DRAM in the era of AI (Artificial Intelligence) and big data,” said SangJoon Hwang, Executive Vice President of DRAM Product & Technology at Samsung Electronics. “We will continue to develop DRAM solutions through differentiated process and design technologies to break the boundaries of memory technology.”
500,000 Fold Increase in DRAM Capacity Since 1983
Samsung developed its first 64-kilobit (Kb) DRAM back in 1983 and now in 2023, the company succeeded in enhancing its DRAM capacity by a factor of 500,000 over the last 40 years.
