On September 26, 2023, the South Korean tech giant Samsung officially announced that the company has developed the industry’s first Low Power Compression Attached Memory Module (LPCAMM) form factor, which is expected to transform the DRAM market for PCs and laptops. Samsung’s groundbreaking development for its 7.5 gigabits-per-second (Gbps) LPCAMM has completed system verification through Intel’s platform. Samsung says, LPCAMM is set to be tested using next-generation systems with major customers this year, and commercialization is planned for 2024.
Earlier, the regular PCs and laptops usually used a type of memory called LPDDR DRAM or DDR-based So-DIMMs. LPDDR is small and fits easily on the computer’s main board, but this makes it tricky to swap out when you need to fix or upgrade your computer. On the flip side, So-DIMMs can be attached or removed quite easily, but they come with some drawbacks like not being as fast and having certain physical limitations.
LPCAMM RAM
LPCAMM overcomes the shortcomings of both LPDDR and So-DIMMs, addressing the increased demand for more efficient yet compact devices. Being a detachable module, LPCAMM offers enhanced flexibility for PC and laptop manufacturers during the production process. Compared to So-DIMM, LPCAMM occupies up to 60% less space on the motherboard. This allows more efficient use of devices’ internal space while also improving performance by up to 50% and power efficiency by up to 70%.
“The energy efficiency and repairability advantages of LPCAMM make this new form factor a game changer in today’s PC market,” said Dr. Dimitrios Ziakas, Vice President of Memory & IO Technology at Intel. “We’re excited to be a part of the new standard enabling the client PC ecosystem and pave the path for future adoption and innovation in broader market segments.”
“With the growing demand in innovative memory solutions encompassing high performance, low power consumption and manufacturing flexibility across various fields, LPCAMM is expected to gain wide adoption in PCs, laptops and data centers,” said Yongcheol Bae, Executive Vice President of Memory Product Planning Team at Samsung Electronics. “Samsung is committed to actively pursuing opportunities to expand the LPCAMM solution market and collaborating closely with the industry to explore new applications for its use.”