Samsung is developing a packaging technology for controlling the heat generation of application processors (APs). It is in the form of a heat path block (HPB) that acts as a heat sink attached to the top of a system-on-chip (SoC). The industry expects that this technology will be applied starting with the next-generation Exynos.
Samsung Electronics’ Advanced Package (AVP) business team has decided to develop Fan-Out Wafer Level Package (FOWLP)-HPB technology by the fourth quarter of this year and complete preparations for mass production.
In the fourth quarter of next year, they will go one step further and develop a FOWLP-System-in-Package (SIP) that can attach HPB and mount multiple dies.
Both packages have the HPB mounted on top of the SoC, with memory placed next to the HPB. The industry predicts that Samsung Electronics’ FOWLP-HPB technology will be first applied to its own AP, Exynos. A post-processing industry insider said, “Since Samsung Electronics owns its own AP, there is a high probability that it will use Exynos as a test bed when developing new technologies.”