As per the Director of TSMC’s Ecosystem and Alliance Management Department, the company is working with Samsung Electronics to develop unbuffered HBM4 memory.
This is also the first time that Samsung Electronics and TSMC, two semiconductor companies that compete in the fields of advanced process and packaging, have publicly announced their cooperation in the field of HBM memory.
The “unbuffered HBM4 memory” is a special variant of HBM4 that eliminates the buffer used to distribute voltage and prevent electrical problems . Samsung Electronics’ first batch of standard HBM4 memory will be launched in 2025.
“As memory manufacturing processes become more complex, collaboration with partners becomes increasingly important,” said Kochpatcharin.
Lee Jeong-bae, president and general manager of the memory business at Samsung Electronics’ DS division, mentioned at the event that the company is working with other foundries (including TSMC) to provide more than 20 customized HBM memory solutions.
